About the Application of Sapphire Polishing Slurry, CMP Slurry, CMP Polishing Slurry, and CMP Grinding Slurry

Key Features

The sapphire substrate CMP slurry utilizes high-purity nano-SiO₂ hydrosol independently synthesized and produced by our company, ensuring high automation in production and outstanding stability. During manufacturing, the slurry is prepared through an automated process, with additives precisely measured using high-precision flow meters. The production method includes comprehensive multi-directional stirring, two-layer folded filter cartridge filtration, and automated packaging. As a result, the product contains minimal metallic impurities, is easy to clean, non-toxic, and environmentally friendly. It achieves high removal rates, minimal damage layers, and excellent flatness, preventing scratches on the wafer.  

The HPHE/SPS-SH-1813 CMP slurry incorporates unique polishing accelerators and active substances, ensuring consistent mass transfer during the CMP process and improving polishing efficiency.  

Through optimized formulation ratios, the product achieves outstanding performance within recommended parameters. Additionally, it exhibits non-crystallizing characteristics during polishing, minimal scratching, and can be recycled for repeated use.

Usage Instructions

For the HPHE/SPS-SH-1813 sapphire substrate CMP slurry, it is recommended to mix with deionized water at a ratio of **1:1 for recyclable applications**, or **1:2–3 for non-recyclable use**. The ratio can also be adjusted according to specific process requirements.